Zinc Oxide Sputtering Target (ZnO)
The S4R Zinc Oxide Sputtering Target (ZnO) is manufactured from 99.99% (4N) zinc oxide ceramic for physical vapor deposition (PVD) and magnetron sputtering applications.
Zinc oxide is a wide-bandgap semiconducting oxide material valued for its optical transparency, chemical stability and versatile electronic properties. ZnO sputtering targets are suitable for the deposition of transparent oxide films, semiconducting layers, piezoelectric coatings, UV optoelectronic films, sensor coatings and advanced thin-film research.
Standard S4R targets are supplied as circular discs in 2-inch and 3-inch diameters with a nominal thickness of 3 mm. Alternative dimensions, thicknesses and bonded configurations are available upon request.
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Sputtering and Compatibility
Zinc oxide is a semiconducting oxide ceramic material. RF magnetron sputtering is the recommended standard deposition method for direct sputtering from a ZnO target.
Actual deposition conditions depend on the sputtering-source design, RF generator and matching network, applied RF power and power density, working pressure, process-gas composition, target-to-substrate distance, substrate material and temperature, target cooling and required film properties.
S4R does not specify universal RF power, working pressure, substrate temperature or deposition rate. These parameters must be established according to the sputtering system, target dimensions and required film characteristics.
Film stoichiometry, carrier concentration, texture and optical or electrical properties may vary depending on deposition conditions, oxygen content in the process gas, substrate temperature and post-deposition treatment.
Because ceramic targets are brittle and sensitive to thermal gradients, appropriate cooling, uniform thermal contact and progressive power conditioning are recommended during operation.
Bonding services, backing plates, alternative thicknesses and custom target dimensions are available upon request.
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