Titanium Sputtering Target (Ti)

The S4R Titanium Sputtering Target is manufactured from high-purity titanium metal for physical vapor deposition and magnetron sputtering applications.

Titanium is a lightweight, corrosion-resistant metal with good mechanical strength and a strong affinity for reactive gases. It is widely used for the deposition of metallic, adhesion-promoting, protective and functional thin films in research, electronics, optics, energy and materials science.

The target is available in two standard laboratory formats with a nominal purity of 99.99% (4N):

Ø50.8 × 3 mm
Ø76.2 × 3 mm

Other dimensions, thicknesses, purity grades and backing-plate configurations may be available upon request.

Pricing available to approved customers

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Target Size
- Ø50.8 × 3 mm (2 in.)
- Ø76.2 × 3 mm (3 in.)

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Specification
Product Name	Titanium Sputtering Target
Material	Titanium
Chemical Symbol	Ti
CAS Number	7440-32-6
Purity	99.99% (4N)
Shape	Circular Disc
Standard Size 1	Ø50.8 × 3 mm
Standard Size 2	Ø76.2 × 3 mm
Imperial Equivalents	2 in. or 3 in. diameter
Quantity	1 Target
Appearance	Metallic, Silvery-Grey
Odor	Odorless
Atomic Number	22
Atomic Weight	47.867 g/mol
Theoretical Density	Approximately 4.51 g/cm³
Melting Point	Approximately 1,668 °C
Thermal Conductivity	Approximately 22 W·m⁻¹·K⁻¹
Coefficient of Thermal Expansion	Approximately 8.6 × 10⁻⁶ K⁻¹
Magnetic Behavior	Non-Ferromagnetic
Recommended Sputtering Mode	DC Magnetron Sputtering
Reactive Sputtering Compatibility	Suitable for TiN, TiO₂ and Related Thin Films
Standard Configuration	Unbonded Solid Target
Bonding Options	Available Upon Request

Titanium Sputtering Target (Ti)

0.00 € 0.0 EUR 0.00 €

Pricing available to approved customers

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