Titanium Dioxide Sputtering Target (TiO₂)
The S4R Titanium Dioxide Sputtering Target (TiO₂) is manufactured from titanium dioxide ceramic for physical vapor deposition (PVD) and magnetron sputtering applications.
Titanium dioxide is a functional oxide material valued for its high refractive index, chemical stability and versatile optical and electronic properties. TiO₂ sputtering targets are widely used for the deposition of optical coatings, dielectric and functional oxide films, protective layers, photocatalytic coatings, semiconductor structures and advanced thin-film research.
Standard S4R targets are supplied as circular discs in 2-inch and 3-inch diameters with a nominal thickness of 3 mm. Alternative dimensions, thicknesses and bonded configurations are available upon request.
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Sputtering and Compatibility
Titanium dioxide is an electrically resistive oxide ceramic. RF magnetron sputtering is therefore the recommended standard deposition method for direct sputtering from a TiO₂ target. RF reactive sputtering may also be used when control of the oxygen partial pressure is required.
Actual deposition conditions depend on the sputtering-source design, RF generator and matching network, applied RF power and power density, working pressure, argon-to-oxygen ratio, target-to-substrate distance, substrate material and temperature, target cooling and required film properties.
S4R does not specify universal RF power, working pressure, oxygen flow, substrate temperature or deposition rate. These parameters must be established according to the sputtering system and the required film composition, structure and properties.
TiO₂ films may exhibit different stoichiometries and crystalline phases depending on deposition and post-treatment conditions. The phase of the bulk target should therefore not be assumed to determine the phase of the deposited film unless specifically documented.
Because ceramic targets are brittle and sensitive to thermal gradients, appropriate cooling, uniform thermal contact and progressive power conditioning are recommended during operation.
Bonding services, backing plates, alternative thicknesses and custom target dimensions are available upon request.
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