Tin Sputtering Target (Sn)

The S4R Tin Sputtering Target is manufactured from high-purity tin metal for physical vapor deposition and magnetron sputtering applications.

Tin is a soft, electrically conductive metal with a relatively low melting point and good resistance to atmospheric corrosion. It is commonly used for the deposition of conductive, solderable, protective and functional thin films in electronics, sensors, energy-storage research, transparent conductive oxide development and materials science.

The target is available in two standard laboratory formats with a nominal purity of 99.99% (4N):

Ø50.8 × 3 mm
Ø76.2 × 3 mm

Other dimensions, thicknesses, purity grades and backing-plate configurations may be available upon request.

Pricing available to approved customers

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Target Size
- Ø50.8 × 3 mm (2 in.)
- Ø76.2 × 3 mm (3 in.)

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Specification
Product Name	Tin Sputtering Target
Material	Tin
Chemical Symbol	Sn
CAS Number	7440-31-5
Purity	99.99% (4N)
Shape	Circular Disc
Standard Size 1	Ø50.8 × 3 mm
Standard Size 2	Ø76.2 × 3 mm
Imperial Equivalents	2 in. or 3 in. diameter
Quantity	1 Target
Appearance	Metallic, Silvery-White
Odor	Odorless
Atomic Number	50
Atomic Weight	118.710 g/mol
Theoretical Density	Approximately 7.31 g/cm³
Melting Point	Approximately 232 °C
Thermal Conductivity	Approximately 67 W·m⁻¹·K⁻¹
Coefficient of Thermal Expansion	Approximately 22 × 10⁻⁶ K⁻¹
Magnetic Behavior	Non-Ferromagnetic
Recommended Sputtering Mode	DC Magnetron Sputtering
Standard Configuration	Unbonded Solid Target
Bonding Options	Available Upon Request

Tin Sputtering Target (Sn)

0.00 € 0.0 EUR 0.00 €

Pricing available to approved customers

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