Tantalum Sputtering Target (Ta)

The S4R Tantalum Sputtering Target is manufactured from high-purity tantalum metal for physical vapor deposition and magnetron sputtering applications.

Tantalum is a dense refractory metal characterized by a very high melting point, excellent corrosion resistance, good thermal stability and stable electrical properties. It is widely used for the deposition of conductive, diffusion-barrier, protective and functional thin films in semiconductor, microelectronic, optical, energy-storage and materials-science research.

The target is available in two standard laboratory formats with a nominal purity of 99.95% (3N5):

Ø50.8 × 3 mm
Ø76.2 × 3 mm

Other dimensions, thicknesses, purity grades and backing-plate configurations may be available upon request.

Pricing available to approved customers

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Target Size
- Ø50.8 × 3 mm (2 in.)
- Ø76.2 × 3 mm (3 in.)

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Specification
Product Name	Tantalum Sputtering Target
Material	Tantalum
Chemical Symbol	Ta
CAS Number	7440-25-7
Purity	99.95% (3N5)
Shape	Circular Disc
Standard Size 1	Ø50.8 × 3 mm
Standard Size 2	Ø76.2 × 3 mm
Imperial Equivalents	2 in. or 3 in. diameter
Quantity	1 Target
Appearance	Metallic, Blue-Grey
Odor	Odorless
Atomic Number	73
Atomic Weight	180.9479 g/mol
Theoretical Density	Approximately 16.69 g/cm³
Melting Point	Approximately 3,017 °C
Thermal Conductivity	Approximately 57 W·m⁻¹·K⁻¹
Coefficient of Thermal Expansion	Approximately 6.3 × 10⁻⁶ K⁻¹
Magnetic Behavior	Non-Ferromagnetic
Recommended Sputtering Mode	DC Magnetron Sputtering
Standard Configuration	Unbonded Solid Target
Bonding Options	Available Upon Request

Tantalum Sputtering Target (Ta)

0.00 € 0.0 EUR 0.00 €

Pricing available to approved customers

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