Tantalum Pentoxide Sputtering Target (Ta₂O₅)
The S4R Tantalum Pentoxide Sputtering Target (Ta₂O₅) is manufactured from 99.99% (4N) tantalum pentoxide ceramic for physical vapor deposition (PVD) and RF magnetron sputtering applications.
Tantalum pentoxide is an electrically insulating high-k oxide valued for its high refractive index, dielectric properties and chemical stability. Ta₂O₅ sputtering targets are suitable for the deposition of high-k dielectric films, optical coatings, capacitor dielectric layers, waveguide structures, semiconductor devices and advanced thin-film research.
Standard S4R targets are supplied as circular discs in 2-inch and 3-inch diameters with a nominal thickness of 3 mm. Alternative dimensions, thicknesses and bonded configurations are available upon request.
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Sputtering and Compatibility
Tantalum pentoxide is an electrically insulating oxide ceramic. RF magnetron sputtering is therefore the recommended standard deposition method for direct sputtering from a Ta₂O₅ target.
Actual deposition conditions depend on the sputtering-source design, RF generator and matching network, applied RF power and power density, working pressure, process-gas composition, target-to-substrate distance, substrate material and temperature, target cooling and required film properties.
S4R does not specify universal RF power, working pressure, oxygen content, substrate temperature or deposition rate. These parameters must be established according to the sputtering system, target dimensions and required film characteristics.
The stoichiometry, density, crystallinity, dielectric properties and optical properties of deposited Ta₂O₅ films may vary with process conditions, oxygen partial pressure, substrate temperature and post-deposition treatment. The crystalline phase of the deposited film should therefore not be assumed to reproduce that of the bulk target.
Because Ta₂O₅ ceramic targets are brittle and may be sensitive to thermal gradients, appropriate cooling, uniform thermal contact and progressive power conditioning are recommended during operation.
Bonding services, backing plates, alternative thicknesses and custom target dimensions are available upon request.
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