Platinum sputtering target for thin-film electrodes, sensors and functional coating research. Select a requested size in 99.99% Pt (4N), or discuss a custom specification for your deposition system. Final dimensions, tolerances, mounting requirements, batch documentation, price and lead time are confirmed by quotation before ordering.
4N platinum for thin-film electrodes and functional coatings
A platinum source for sputter deposition in research laboratories. Select your requested target dimensions, then confirm the complete specification with S4R for your cathode, substrate and deposition process.
Material
Pt
Selected grade
99.99%
Requested diameter
2 or 3 in
Supply
On quotation
Product highlights
Define the target around your process
01
4N platinum
Specify 99.99% Pt for the target material. Include any impurity limits or analysis requirements in your enquiry.
02
Three requested formats
Choose the diameter and thickness together, using the exact metric and imperial dimensions below.
03
Target-only configuration
The selected configuration covers the platinum target. Backing plates and bonding are reviewed separately.
04
Custom requirements
Other dimensions, machining details and 5N purity can be reviewed on request, with feasibility confirmed in your quotation.
Configuration
Choose your requested dimensions
The selector records your preferred format. Final dimensions, tolerances and availability are confirmed before ordering.
Requested platinum target dimensions
Target diameter
Target thickness
Ø50.8 mm · 2 in
1.5875 mm · 1/16 in
Ø50.8 mm · 2 in
3.175 mm · 1/8 in
Ø76.2 mm · 3 in
3.175 mm · 1/8 in
Dimensions refer to the target itself, excluding any backing plate. A 3 mm target and a 3.175 mm target are distinct specifications. Check the cathode drawing before selection.
Technical data
Technical specifications
The supplied configuration is defined in the final quotation.
Platinum sputtering target specifications
Parameter
Specification
Material
Platinum · Pt
CAS number
7440-06-4
Selected purity
99.99% Pt (4N); certification basis and batch documentation confirmed on quotation
Requested form
Flat circular sputtering target
Requested dimensions
As selected in the table above; machining tolerances to be agreed
Deposition method
DC sputtering for conductive platinum; validate the target assembly with your system
Backing plate and bonding
Not included in the target-only configuration; assessed separately on request
Supply unit
One platinum target
Price and lead time
Confirmed by quotation for the selected specification and quantity
The product image is a representative illustration of a flat target. It is not a dimensional drawing or evidence of the supplied finish, thickness or certification.
Applications & technical notes
Thin-film and electrode research
Match the material specification and target assembly to the experiment.
Research applications
Platinum thin-film electrodes and contact layers.
Sensor and semiconductor research.
Functional coating and layer-stack development.
Need another configuration? Send S4R your drawing, required purity, quantity and documentation requirements. Discuss your target specification.
S4R · Thin Film & Deposition
Platinum Sputtering Target
4N platinum for thin-film electrodes and functional coatings
A platinum source for sputter deposition in research laboratories. Select your requested target dimensions, then confirm the complete specification with S4R for your cathode, substrate and deposition process.
Material
Pt
Selected grade
99.99%
Requested diameter
2 or 3 in
Supply
On quotation
Product highlights
Define the target around your process
01
4N platinum
Specify 99.99% Pt for the target material. Include any impurity limits or analysis requirements in your enquiry.
02
Three requested formats
Choose the diameter and thickness together, using the exact metric and imperial dimensions below.
03
Target-only configuration
The selected configuration covers the platinum target. Backing plates and bonding are reviewed separately.
04
Custom requirements
Other dimensions, machining details and 5N purity can be reviewed on request, with feasibility confirmed in your quotation.
Configuration
Choose your requested dimensions
The selector records your preferred format. Final dimensions, tolerances and availability are confirmed before ordering.
Requested platinum target dimensions
Target diameter
Target thickness
Ø50.8 mm · 2 in
1.5875 mm · 1/16 in
Ø50.8 mm · 2 in
3.175 mm · 1/8 in
Ø76.2 mm · 3 in
3.175 mm · 1/8 in
Dimensions refer to the target itself, excluding any backing plate. A 3 mm target and a 3.175 mm target are distinct specifications. Check the cathode drawing before selection.
Technical data
Technical specifications
The supplied configuration is defined in the final quotation.
Platinum sputtering target specifications
Parameter
Specification
Material
Platinum · Pt
CAS number
7440-06-4
Selected purity
99.99% Pt (4N); certification basis and batch documentation confirmed on quotation
Requested form
Flat circular sputtering target
Requested dimensions
As selected in the table above; machining tolerances to be agreed
Deposition method
DC sputtering for conductive platinum; validate the target assembly with your system
Backing plate and bonding
Not included in the target-only configuration; assessed separately on request
Supply unit
One platinum target
Price and lead time
Confirmed by quotation for the selected specification and quantity
The product image is a representative illustration of a flat target. It is not a dimensional drawing or evidence of the supplied finish, thickness or certification.
Applications & technical notes
Thin-film and electrode research
Match the material specification and target assembly to the experiment.
Research applications
Platinum thin-film electrodes and contact layers.
Sensor and semiconductor research.
Functional coating and layer-stack development.
Need another configuration? Send S4R your drawing, required purity, quantity and documentation requirements. Discuss your target specification.
