Aluminum Sputtering Target (Al)

The S4R Aluminum Sputtering Target is manufactured from high-purity aluminum metal for physical vapor deposition and magnetron sputtering applications.

Aluminum is a lightweight, electrically conductive metal with good thermal conductivity and natural corrosion resistance. It is widely used for the deposition of conductive, reflective, protective and functional thin films in research, electronics, optics and materials-science laboratories.

The target is available in two standard laboratory formats with a nominal purity of 99.99% (4N):

Ø50.8 × 3 mm
Ø76.2 × 3 mm

Other dimensions, thicknesses, purity grades and backing-plate configurations may be available upon request.

Pricing available to approved customers

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Target Size
- Ø50.8 × 3 mm (2 in.)
- Ø76.2 × 3 mm (3 in.)

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Specification
Product Name	Aluminum Sputtering Target
Material	Aluminum
Chemical Symbol	Al
CAS Number	7429-90-5
Purity	99.99% (4N)
Shape	Circular Disc
Standard Size 1	Ø50.8 × 3 mm
Standard Size 2	Ø76.2 × 3 mm
Imperial Equivalents	2 in. or 3 in. diameter
Quantity	1 Target
Appearance	Metallic, Silvery-White
Odor	Odorless
Atomic Number	13
Atomic Weight	26.9815 g/mol
Theoretical Density	Approximately 2.70 g/cm³
Melting Point	Approximately 660 °C
Thermal Conductivity	Approximately 237 W·m⁻¹·K⁻¹
Coefficient of Thermal Expansion	Approximately 23.1 × 10⁻⁶ K⁻¹
Magnetic Behavior	Non-Ferromagnetic
Recommended Sputtering Mode	DC Magnetron Sputtering
Standard Configuration	Unbonded Solid Target
Bonding Options	Available Upon Request

Aluminum Sputtering Target (Al)

0.00 € 0.0 EUR 0.00 €

Pricing available to approved customers

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