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Lithium Nickel Cobalt Aluminum Oxide Sputtering Target (NCA)

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The S4R Lithium Nickel Cobalt Aluminum Oxide Sputtering Target is manufactured from high-purity ceramic material with the nominal composition:

LiNi₀.₈₅Co₀.₁₄Al₀.₀₁O₂

The transition-metal and aluminum ratio is:

Ni:Co:Al = 85:14:1 at.%

This composition belongs to the NCA family of nickel-rich layered lithium transition-metal oxides used as positive-electrode materials in lithium-ion battery research. NCA compositions are not defined by a single universal Ni:Co:Al ratio, so the exact 85:14:1 atomic ratio is stated throughout this product page. Related NCA materials are generally characterized by a layered oxide structure, with their properties depending on composition, synthesis and thermal history.

In thin-film form, this NCA composition is relevant to lithium-ion battery research, microbattery development, all-solid-state battery studies, cathode–electrolyte interface investigations and electrochemical thin-film characterization.

The standard S4R configuration is supplied as a 2-inch ceramic target indium-bonded to a 3 mm thick copper backing plate, with a purity of 99.9% (3N):

  • Target diameter: Ø50.8 mm (2 in.)
  • NCA target thickness: 3.18 mm (0.125 in.)
  • Copper backing plate thickness: 3 mm
  • Total nominal assembly thickness: approximately 6.18 mm, excluding the bonding layer
  • Standard bonding method: indium bonding
  • Purity: 99.9% (3N)
  • Nominal composition: LiNi₀.₈₅Co₀.₁₄Al₀.₀₁O₂
  • Ni:Co:Al atomic ratio: 85:14:1

Alternative target dimensions, backing-plate materials, backing-plate geometries, bonding methods and unbonded configurations may be available upon request. Final compatibility must be confirmed according to the customer’s sputtering cathode and mounting system.

The standard product corresponds to the nominal composition LiNi₀.₈₅Co₀.₁₄Al₀.₀₁O₂. Lithium-enriched, lithium-deficient, doped, coated or otherwise modified compositions must be identified separately and should not be considered equivalent to this standard target.

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Sputtering and Compatibility

NCA is a multicomponent ceramic oxide. RF magnetron sputtering is therefore the recommended standard starting method for this target configuration.

The copper backing plate provides mechanical support and promotes heat transfer between the ceramic target and the cooled sputtering cathode. The indium bonding layer improves thermal contact while accommodating part of the thermal-expansion difference between the ceramic target and the metallic backing plate.

Actual deposition conditions depend on:

  • sputtering-source design;
  • RF generator and matching network;
  • target density, porosity and microstructure;
  • Ni:Co:Al ratio and chemical homogeneity;
  • lithium and oxygen stoichiometry;
  • bonding quality and cathode cooling;
  • sputtering-gas composition and pressure;
  • substrate material and temperature;
  • desired film composition and crystallinity;
  • post-deposition thermal treatment.

S4R does not specify universal RF power, gas pressure, substrate temperature or annealing conditions. These parameters must be developed according to the customer’s equipment and required film properties.

The deposited film should not automatically be assumed to reproduce the bulk target composition or crystalline phase exactly. Lithium loss, preferential sputtering, oxygen non-stoichiometry and post-deposition thermal treatment may alter the resulting film. Its elemental composition, Ni:Co:Al ratio and crystalline phase should therefore be verified experimentally.

Specification
Product Name Lithium Nickel Cobalt Aluminum Oxide Sputtering Target
Material Lithium Nickel Cobalt Aluminum Oxide
Nominal Chemical Formula LiNi₀.₈₅Co₀.₁₄Al₀.₀₁O₂
Abbreviation NCA
Ni:Co:Al Atomic Ratio 85:14:1 at.%
Purity 99.9% (3N)
Nominal Composition LiNi₀.₈₅Co₀.₁₄Al₀.₀₁O₂
Material Type Nickel-Rich Layered Lithium Transition-Metal Oxide Ceramic
Nominal Crystal Structure Layered Oxide Structure
Battery Function Cathode / Positive-Electrode Material
Shape Circular Disc
Standard Target Diameter Ø50.8 mm (2 in.)
Target Material Thickness 3.18 mm (0.125 in.)
Standard Target Size Ø50.8 × 3.18 mm (2 in. × 0.125 in.)
Backing Plate Material Copper
Backing Plate Thickness 3 mm
Bonding Method Indium Bonding
Standard Configuration NCA Ceramic Target Indium-Bonded to a Copper Backing Plate
Total Nominal Assembly Thickness Approximately 6.18 mm, Excluding the Bonding Layer
Quantity 1 Target Assembly
Appearance Ceramic Surface; Color May Vary According to Manufacturing Conditions and Batch
Calculated Molar Mass Approximately 97.35 g/mol
Recommended Sputtering Mode RF Magnetron Sputtering
Modified Compositions Alternative Ni:Co:Al Ratios, Lithium-Enriched or Doped Compositions Available Upon Request
Alternative Bonding Methods Available Upon Request
Alternative Backing Plates Available Upon Request
Unbonded Configuration Available Upon Request
Custom Dimensions Available Upon Request

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