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Lithium Titanate Sputtering Target (Li₄Ti₅O₁₂, LTO)

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The S4R Lithium Titanate Sputtering Target is manufactured from high-purity Li₄Ti₅O₁₂ ceramic for physical vapor deposition and magnetron sputtering applications.

Lithium titanate, commonly designated LTO, is a lithium–titanium oxide with a spinel-related crystal structure. Unlike the lithium transition-metal oxides previously presented as positive-electrode materials, Li₄Ti₅O₁₂ is primarily used as a negative-electrode, or anode, material in lithium-ion battery research. It is valued for its structural stability during lithium insertion and extraction, long cycle-life potential and operation at approximately 1.55 V versus Li/Li⁺.

LTO is frequently described as a “zero-strain” insertion material because its lattice undergoes only a very small dimensional change during the relevant electrochemical transformation. This description does not imply absolutely zero deformation under every processing or electrochemical condition.

In thin-film form, Li₄Ti₅O₁₂ is relevant to lithium-ion microbattery research, all-solid-state battery systems, anode–electrolyte interface studies and electrochemical thin-film characterization.

The standard S4R configuration is supplied as a 2-inch ceramic target indium-bonded to a 3 mm thick copper backing plate, with a purity of 99.9% (3N):

  • Target diameter: Ø50.8 mm (2 in.)
  • Li₄Ti₅O₁₂ target thickness: 3.18 mm (0.125 in.)
  • Copper backing plate thickness: 3 mm
  • Total nominal assembly thickness: approximately 6.18 mm, excluding the bonding layer
  • Standard bonding method: indium bonding
  • Purity: 99.9% (3N)
  • Nominal composition: Li₄Ti₅O₁₂
  • Battery function: negative-electrode material

Alternative target dimensions, backing-plate materials, backing-plate geometries, bonding methods and unbonded configurations may be available upon request. Final compatibility must be confirmed according to the customer’s sputtering cathode and mounting system.

The standard product corresponds to nominal Li₄Ti₅O₁₂. Carbon-containing, oxygen-deficient, lithium-enriched, doped or otherwise modified compositions must be identified separately and should not be considered equivalent to the standard material.

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Sputtering and Compatibility

Li₄Ti₅O₁₂ is a multicomponent ceramic oxide. RF magnetron sputtering is therefore the recommended standard starting method for this target configuration.

The copper backing plate provides mechanical support and promotes heat transfer between the ceramic target and the cooled sputtering cathode. The indium bonding layer improves thermal contact while accommodating part of the thermal-expansion difference between the ceramic target and the metallic backing plate.

Actual deposition conditions depend on:

  • sputtering-source design;
  • RF generator and matching network;
  • target density, porosity and microstructure;
  • chemical homogeneity and lithium content;
  • oxygen stoichiometry;
  • bonding quality and cathode cooling;
  • sputtering-gas composition and pressure;
  • substrate material and temperature;
  • desired film composition and crystallinity;
  • post-deposition thermal treatment.

S4R does not specify universal RF power, gas pressure, substrate temperature or annealing conditions. These parameters must be developed according to the customer’s equipment and required film properties.

The deposited film should not automatically be assumed to reproduce the bulk target composition or crystalline phase exactly. Lithium loss, preferential sputtering, oxygen non-stoichiometry and thermal treatment may affect the resulting film. Its elemental composition and phase should therefore be verified experimentally.

Specification
Product Name Lithium Titanate Sputtering Target
Material Lithium Titanate
Chemical Formula Li₄Ti₅O₁₂
Abbreviation LTO
Alternative Name Lithium Titanium Oxide
Purity 99.9% (3N)
Nominal Composition Li₄Ti₅O₁₂
Material Type Lithium Titanium Oxide Ceramic
Nominal Crystal Structure Spinel-Related Structure
Battery Function Anode / Negative-Electrode Material
Shape Circular Disc
Standard Target Diameter Ø50.8 mm (2 in.)
Target Material Thickness 3.18 mm (0.125 in.)
Standard Target Size Ø50.8 × 3.18 mm (2 in. × 0.125 in.)
Backing Plate Material Copper
Backing Plate Thickness 3 mm
Bonding Method Indium Bonding
Standard Configuration LTO Ceramic Target Indium-Bonded to a Copper Backing Plate
Total Nominal Assembly Thickness Approximately 6.18 mm, Excluding the Bonding Layer
Quantity 1 Target Assembly
Appearance Ceramic Surface; Color May Vary According to Manufacturing Conditions and Batch
Calculated Molar Mass Approximately 459.09 g/mol
Recommended Sputtering Mode RF Magnetron Sputtering
Modified Compositions Lithium-Enriched, Oxygen-Deficient, Doped or Carbon-Containing Compositions Available Upon Request
Alternative Bonding Methods Available Upon Request
Alternative Backing Plates Available Upon Request
Unbonded Configuration Available Upon Request
Custom Dimensions Available Upon Request

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