Lithium Nickel Manganese Cobalt Oxide Sputtering Target (NMC523)
The S4R Lithium Nickel Manganese Cobalt Oxide Sputtering Target is manufactured from a multicomponent ceramic material with a nominal nickel, manganese and cobalt molar ratio of 5:2:3 for physical vapor deposition and magnetron sputtering applications.
The normalized composition is:
LiNi₀.₅Mn₀.₂Co₀.₃O₂
This composition is commonly designated NMC523. It belongs to the family of layered lithium transition-metal oxides used as positive-electrode materials in lithium-ion battery research. The designation “523” refers specifically to the nominal transition-metal ratio Ni:Mn:Co = 5:2:3.
In thin-film form, NMC523 is relevant to lithium-ion battery research, microbattery development, solid-state battery studies, cathode–electrolyte interface investigations and electrochemical thin-film characterization.
The standard S4R configuration is supplied as a 2-inch ceramic target indium-bonded to a 3 mm thick copper backing plate:
- Target diameter: Ø50.8 mm (2 in.)
- NMC523 target thickness: 3.18 mm (0.125 in.)
- Copper backing plate thickness: 3 mm
- Total nominal assembly thickness: approximately 6.18 mm, excluding the bonding layer
- Standard bonding method: indium bonding
- Ni:Mn:Co molar ratio: 5:2:3
- Purity: to be confirmed according to the product specification and batch certificate
Alternative dimensions, backing-plate configurations, bonding methods and unbonded targets may be available upon request. Final compatibility must be confirmed according to the customer’s sputtering cathode and mounting system.
The standard product corresponds to the nominal NMC523 composition. Lithium-enriched, lithium-deficient, doped, coated or otherwise modified compositions must be identified separately and should not be presented as equivalent to the standard material.
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Sputtering and Compatibility
NMC523 is a multicomponent ceramic oxide. RF magnetron sputtering is therefore the prudent standard recommendation for this bonded target configuration.
The copper backing plate provides mechanical support and promotes heat transfer between the ceramic target and the cooled sputtering cathode. The indium bonding layer improves thermal contact while accommodating part of the difference in thermal expansion between the ceramic target and the metallic support.
Actual deposition conditions depend on:
- sputtering-source design;
- RF generator and matching network;
- target density, porosity and microstructure;
- target composition and chemical homogeneity;
- lithium content;
- bonding quality and cathode cooling;
- sputtering-gas composition and pressure;
- substrate material and temperature;
- required film stoichiometry and crystallinity;
- post-deposition thermal treatment.
S4R should not specify a universal RF power, gas pressure, substrate temperature or annealing condition. These parameters must be developed according to the customer’s sputtering equipment and required film properties.
The deposited film must not automatically be assumed to reproduce the bulk target composition exactly. Lithium-containing multicomponent oxides may experience lithium loss, preferential sputtering or other composition changes during deposition and heat treatment. The final composition and crystalline phase should therefore be confirmed experimentally.
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