Copper Sputtering Target (Cu)

The S4R Copper Sputtering Target is manufactured from high-purity copper metal for physical vapor deposition and magnetron sputtering applications.

Copper is a highly conductive metallic material with excellent electrical and thermal conductivity. It is widely used for the deposition of conductive, reflective and functional thin films in electronics, energy-storage research, sensors, optical systems and materials-science laboratories.

The target is available in two standard laboratory formats with a nominal purity of 99.99% (4N):

Ø50.8 × 3 mm
Ø76.2 × 3 mm

Other dimensions, thicknesses, purity grades and backing-plate configurations may be available upon request.

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Target Size
- Ø50.8 × 3 mm (2 in.)
- Ø76.2 × 3 mm (3 in.) + 120.00 €

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Specification
Product Name	Copper Sputtering Target
Material	Copper
Chemical Symbol	Cu
CAS Number	7440-50-8
Purity	99.99% (4N)
Shape	Circular Disc
Standard Size 1	Ø50.8 × 3 mm
Standard Size 2	Ø76.2 × 3 mm
Imperial Equivalents	2 in. or 3 in. diameter
Quantity	1 Target
Appearance	Metallic, Reddish-Orange
Odor	Odorless
Atomic Number	29
Atomic Weight	63.546 g/mol
Theoretical Density	Approximately 8.96 g/cm³
Melting Point	Approximately 1,085 °C
Thermal Conductivity	Approximately 401 W·m⁻¹·K⁻¹
Coefficient of Thermal Expansion	Approximately 16.5 × 10⁻⁶ K⁻¹
Magnetic Behavior	Non-Ferromagnetic
Recommended Sputtering Mode	DC Magnetron Sputtering
Standard Configuration	Unbonded Solid Target
Bonding Options	Available Upon Request

Copper Sputtering Target (Cu)

0.00 € 0.0 EUR 0.00 €

Pricing available to approved customers

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